Responsibilities:

• Construct the product system architecture with the ability to make interdisciplinary trade-offs to optimize for the best cost/performance/time.

• Responsible for headset electrical detailed design (including test and debug) with cross-function team and ODM supplier, conduct design review before design release for production tooling

• Define product requirements and specifications (mechanical, electrical, acoustic, firmware) and test document as necessary to ensure desired quality and performance of the product

• Leading internal team of engineers (mechanical, electrical, acoustic, firmware) and work with ODM partners to complete products

• Building an efficient communication bridge to ODM supplier with worldwide development teams across multiple disciplines (Product Manager, QA, Ops, 3rd party supplier etc.)

• Provide global technical support to other non-engineering functions on key technologies and past, present, and future products

• Develop new technologies/technology platforms

Requir e ments

• 6 years+ experience in product development of electronic products, 2 years experience as a team leader or leading ODM projects is a must.

• Bachelor degree+ in electrical engineering discipline or similar.

• Strong consumer electronic industrial background. Wireless and audio working experience will be a plus.

• Rich design experience for high volume manufacture of consumer electronic product.

• EDA experience in validating schematic and PCB/A layout, prototype bring-up and debugging between Engineering team and ODM, lead team to meet requirement of EMC/EMI, ESD, RF, reliability etc.

• Thorough understanding of, and ability to clearly explain, EE concepts such as A/D, DC/DC supply, RF gain compression, EMI noise suppression techniques, SWR and power measurement

• Strong electrical engineering background with clear understanding of software/firmware development. Track record of learning and understanding other engineering disciplines (software, firmware, mechanical, acoustic)

• Broad exposure to many engineering disciplines: Electrical, Mechanical, Software, Systems, Acoustics

• Strong written and oral communication skills in both English and Mandarin, and strong interpersonal skills

• Ability to work with others in a widely-disbursed, fast-paced team environment

• Excellent time management and organizational skills

Highly Disirerable

• Experience/knowledge of RF design and antenna design for wireless systems

• Experience /knowledge of embedded system design and coding

• Experience working with global engineering team and product management to define products and make tradeoffs

• Experience mentoring junior engineers for technical skills and soft skills

Equal Opportunity Employer (EEO):

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).